Description
Analog Interconnects perform the critical task of transmitting information from component to component, making them extremely important in getting the best out of the connected pieces.
DESIGN FEATURES
Expanded 3-Layer MLISâ„¢ (Multi-Layered Insulation System) that offer high propagation speeds as a result of extremely low dielectric constants.
16 Awg HPBMâ„¢ (High Purity Bi-Metal) conductors combine the characteristics of complementary metals for maximum conductivity and linear frequency response.
4-Layer UMLSâ„¢ (Unitized Multi-Layer Shielding) technology for ultra-wide bandwidth protection from both internal and external noise.
Additional information
| Weight | 8 lbs |
|---|---|
| Dimensions | 17 × 16 × 4 in |
| Level | Constellation, Heritage VE, THB Nebula VE, Titania VE, Heritage GS, Titania GS, Lotus GS |
| Length | 1.0M, 1.5M, 2.0M, 2.5M, 3.0M |
| Termination | RCA, XLR |
| Series | Constellation, Heritage, Nebula, Titania |
Constellation VE Interconnects
Dynamic Design interconnects, in a well-designed and balanced system, will float images that are devoid of boundaries, wrapping around you with a strong sense of 3-D dimensionality, incredibly wide bandwidth frequency extension and, stunning acoustical cues that put you right in the middle of the performance. Our interconnects are designed to get out of the…
















